Given the high cost and several months of effort, our tape out sign off activities
repeatedly verifies the total process which includes code verification, timing analysis,
logics & errors before so it’s ready to proceed to the foundry for manufacturing.
Very different from application software release which is possible to be patched and corrected even
post the release, a extensive logic and design combination of a chip cannot be repaired or stitched up
but would need to go through the whole process with each new version or revision costing time and
money both.
In a more simpler way, this is the final check for all the efforts made so far in the logic and physical
design process to ensure everything is in place and the functionality that was expected will be
delivered after manufacturing.